- 品牌：
-
- BOYD (8)
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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10 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
1,408
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
1,920
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
9,526
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 W/T... |
1-3 days |
5,260
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,406
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,529
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,181
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1-3 days |
8,675
In-stock
|
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|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,777
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
5,905
In-stock
|
查看详情 提交询价 |
