- 品牌:
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- BOYD (4)
- CTS Corporation (1)
- Product Status:
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- Length:
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- Type:
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- Material:
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- Width:
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- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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8 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,897
In-stock
|
查看详情 提交询价 | ||
|
BOYD | HEATSINK BGA 23X23... |
1-3 days |
1,132
In-stock
|
查看详情 提交询价 | ||
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,610
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
34
In-stock
|
查看详情 提交询价 | ||
|
NTE Electronics, Inc. | HEAT SINK-TO-5 TRA... |
1-3 days |
16
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,244
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,052
In-stock
|
查看详情 提交询价 | ||
|
CTS Corporation | HEATSINK CAP .500"H... |
1-3 days |
7,297
In-stock
|
查看详情 提交询价 |
