- 品牌：
-
- BOYD (6)
- Length：
-
- Material：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
7 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
1,766
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
1,684
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 TI... |
1-3 days |
6,000
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 LI... |
1-3 days |
4,312
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
3,265
In-stock
|
查看详情 提交询价 | ||
|
|
NTE Electronics, Inc. | HEAT SINK PLAST.P... |
1-3 days |
166
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,356
In-stock
|
查看详情 提交询价 |
