- 品牌：
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- BOYD (3)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | CPU HEATSINK, CRO... |
1-3 days |
3,417
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
1-3 days |
940
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEAT SINK TO-220 .25... |
1-3 days |
9,682
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU XCU... |
1-3 days |
48,823
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 W/T... |
1-3 days |
306
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,349
In-stock
|
查看详情 提交询价 |
