- 品牌：
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- BOYD (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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4 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1-3 days |
1,760
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
951
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
5,437
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK TO-220/TO... |
1-3 days |
9,279
In-stock
|
查看详情 提交询价 |
