- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
5 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 CL... |
1-3 days |
5,149
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 BL... |
1-3 days |
1,873
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,889
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,794
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,101
In-stock
|
查看详情 提交询价 |
