- 品牌：
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- CUI Devices (1)
- Material：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | ANCHOR HEATSINK ... |
1-3 days |
92
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,506
In-stock
|
查看详情 提交询价 | ||
|
TE Connectivity AMP Connectors | 7 FINS, 2.000 OD HS W... |
1-3 days |
7,639
In-stock
|
查看详情 提交询价 | ||
|
|
TE Connectivity AMP Connectors | 7 FINS,2.000 OD HS W/... |
1-3 days |
9,204
In-stock
|
查看详情 提交询价 | ||
|
|
TE Connectivity AMP Connectors | 7 FINS,2.000 OD HS W/... |
1-3 days |
7,572
In-stock
|
查看详情 提交询价 | ||
|
|
TE Connectivity AMP Connectors | 7 FINS, 2.000 OD HS W... |
1-3 days |
6,605
In-stock
|
查看详情 提交询价 |
