- 品牌：
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- CUI Devices (1)
- Product Status：
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- Material：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1-3 days |
310
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
8,603
In-stock
|
查看详情 提交询价 | ||
|
Wakefield Thermal | HEAT SINK ELLIP F... |
1-3 days |
6,228
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
1-3 days |
5,040
In-stock
|
查看详情 提交询价 | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 37.5M... |
1-3 days |
8
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1-3 days |
7,359
In-stock
|
查看详情 提交询价 |
