- 品牌：
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- BOYD (1)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1-3 days |
841
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
1-3 days |
103
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
7,924
In-stock
|
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|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X9.5M... |
1-3 days |
5,150
In-stock
|
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|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,512
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
17
In-stock
|
查看详情 提交询价 |
