- 品牌：
-
- CUI Devices (2)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 12 ... |
1-3 days |
131
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1-3 days |
1,321
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | 1/2 BRICK HEATSINK... |
1-3 days |
76
In-stock
|
查看详情 提交询价 |
