- 品牌：
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- BOYD (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29X29 X 7.... |
1-3 days |
597
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1-3 days |
226
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X7.5M... |
1-3 days |
32
In-stock
|
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|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
637
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1-3 days |
409
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 29MM X 29... |
1-3 days |
86
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
57
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK 29X29X7.5M... |
1-3 days |
9,597
In-stock
|
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|
Wakefield Thermal | HEATSINK FOR TO22... |
1-3 days |
9,007
In-stock
|
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|
|
Wakefield Thermal | HEATSINK FOR TO22... |
1-3 days |
7,889
In-stock
|
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|
|
Wakefield Thermal | HEATSINK TO-220 PW... |
1-3 days |
6,190
In-stock
|
查看详情 提交询价 |
