- 品牌：
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- CUI Devices (1)
- Product Status：
-
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,922
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
1-3 days |
95
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1-3 days |
53
In-stock
|
查看详情 提交询价 | ||
|
Advanced Thermal Solutions, Inc. | HEATSINK 37X37X14.5M... |
1-3 days |
7,402
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X24.5M... |
1-3 days |
6,862
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
1-3 days |
7,420
In-stock
|
查看详情 提交询价 |
