- 品牌：
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- BOYD (6)
- Comair Rotron (2)
- CUI Devices (1)
- Product Status：
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- Length：
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- Material：
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- Width：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1-3 days |
18,626
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 CL... |
1-3 days |
7,684
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 VE... |
1-3 days |
1,832
In-stock
|
查看详情 提交询价 | ||
|
BOYD | HEATSINK TO-220 CL... |
1-3 days |
1,689
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 8.5... |
1-3 days |
2,325
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 W/T... |
1-3 days |
306
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | BOARD LEVEL HEAT... |
1-3 days |
6,056
In-stock
|
查看详情 提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
1-3 days |
9,909
In-stock
|
查看详情 提交询价 | ||
|
|
Comair Rotron | HEATSINK STAMP 6.... |
1-3 days |
8,209
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,401
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
1-3 days |
6,526
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,272
In-stock
|
查看详情 提交询价 |
