- 品牌：
-
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,741
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM S... |
1-3 days |
358
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
124
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1-3 days |
252
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 27MM X 27... |
1-3 days |
293
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1-3 days |
29
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 27X27X7.5M... |
1-3 days |
6,220
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 30... |
1-3 days |
18
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM F... |
1-3 days |
6,637
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK 21X12MM D... |
1-3 days |
6,302
In-stock
|
查看详情 提交询价 |
