- 品牌：
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- CUI Devices (2)
- Material：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 AL... |
1-3 days |
1,282
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
967
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1-3 days |
57
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1-3 days |
202
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,846
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | 1/8 BRICK HEATSINK... |
1-3 days |
201
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X12.5M... |
1-3 days |
10
In-stock
|
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|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
8,088
In-stock
|
查看详情 提交询价 |
