- Material：
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- Attachment Method：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1-3 days |
1,321
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
400
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1-3 days |
9,183
In-stock
|
查看详情 提交询价 |
