- Material：
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- Attachment Method：
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- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 14 ... |
1-3 days |
72
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
1-3 days |
9,338
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1-3 days |
5,261
In-stock
|
查看详情 提交询价 |
