- 品牌：
-
- CUI Devices (1)
- Sarnikon (6)
- Length：
-
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
8,567
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1-3 days |
938
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 17 ... |
1-3 days |
6,320
In-stock
|
查看详情 提交询价 | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
500
In-stock
|
查看详情 提交询价 | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
500
In-stock
|
查看详情 提交询价 | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
500
In-stock
|
查看详情 提交询价 | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
500
In-stock
|
查看详情 提交询价 | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
500
In-stock
|
查看详情 提交询价 | ||
|
|
Sarnikon | EXTRUDED HEATSIN... |
1-3 days |
500
In-stock
|
查看详情 提交询价 |
