- 品牌：
-
- CUI Devices (2)
- Type：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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9 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1-3 days |
1,760
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1-3 days |
946
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,610
In-stock
|
查看详情 提交询价 | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1-3 days |
414
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,387
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,308
In-stock
|
查看详情 提交询价 | ||
|
TE Connectivity AMP Connectors | QSFP DOUBLE SAN H... |
1-3 days |
8,931
In-stock
|
查看详情 提交询价 | ||
|
|
TE Connectivity AMP Connectors | QSFP SINGLE SAN E... |
1-3 days |
8,629
In-stock
|
查看详情 提交询价 | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP SAN E... |
1-3 days |
5,155
In-stock
|
查看详情 提交询价 |
