- 品牌：
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- BOYD (3)
- CUI Devices (1)
- Length：
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- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ANOD AL... |
1-3 days |
22,553
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 61MM X 58... |
1-3 days |
470
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
1-3 days |
4,812
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
485
In-stock
|
查看详情 提交询价 | ||
|
BOYD | HEAT SINK |
1-3 days |
8,580
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 61MMX58.2... |
1-3 days |
1
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEAT SINK |
1-3 days |
8,019
In-stock
|
查看详情 提交询价 |
