- 品牌：
-
- BOYD (3)
- CTS Corporation (2)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Diameter：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,922
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
6,048
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-220 FO... |
1-3 days |
2,206
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
7,154
In-stock
|
查看详情 提交询价 | ||
|
|
CTS Corporation | THERMAL LINK PRE... |
1-3 days |
9,869
In-stock
|
查看详情 提交询价 | ||
|
|
CTS Corporation | THERMAL LINK PRE... |
1-3 days |
7,302
In-stock
|
查看详情 提交询价 |
