- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- 已选条件：
3 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,903
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,736
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
400
In-stock
|
查看详情 提交询价 |
