- 品牌：
-
- BOYD (12)
- CTS Corporation (3)
- CUI Devices (8)
- Ohmite (3)
- Product Status：
-
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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30 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 PO... |
1-3 days |
14,001
In-stock
|
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|
|
BOYD | HEATSINK TO-220 H=2... |
1-3 days |
5,283
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
7,331
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1-3 days |
1,825
In-stock
|
查看详情 提交询价 | ||
|
|
CTS Corporation | HEATSINK PWR W/PI... |
1-3 days |
1,000
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-218 10W... |
1-3 days |
2,113
In-stock
|
查看详情 提交询价 | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1-3 days |
8
In-stock
|
查看详情 提交询价 | ||
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,445
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,322
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,227
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,052
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,182
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
1-3 days |
5,330
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,682
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
7,693
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
9,366
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,452
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK MULTIWA... |
1-3 days |
8,910
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/P... |
1-3 days |
8,474
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK MULTIWA... |
1-3 days |
7,935
In-stock
|
查看详情 提交询价 |
