- 品牌：
-
- BOYD (1)
- CUI Devices (1)
- Product Status：
-
- Material：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
1,922
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-218/TO... |
1-3 days |
2,055
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220/TO... |
1-3 days |
7,359
In-stock
|
查看详情 提交询价 |
