- 品牌：
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- BOYD (2)
- Type：
-
- Material：
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- Shape：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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6 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-220 LO... |
1-3 days |
12,172
In-stock
|
查看详情 提交询价 | ||
|
|
NTE Electronics, Inc. | HEAT SINK FOR TO-... |
1-3 days |
222
In-stock
|
查看详情 提交询价 | ||
|
|
BOYD | HEATSINK TO-202 CL... |
1-3 days |
9,162
In-stock
|
查看详情 提交询价 | ||
|
Wakefield Thermal | HEATSINK TO-220 |
1-3 days |
8,036
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-221 |
1-3 days |
9,543
In-stock
|
查看详情 提交询价 | ||
|
|
Wakefield Thermal | HEATSINK TO-220 CL... |
1-3 days |
8,266
In-stock
|
查看详情 提交询价 |
