- 品牌：
-
- CUI Devices (3)
- iBASE Technology (1)
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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8 条记录
| 图片 | 型号 | 品牌 | 描述 | Factory Lead Time | 库存 | 操作 | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
194
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
51
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
43
In-stock
|
查看详情 提交询价 | ||
|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
8,463
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
6,512
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,568
In-stock
|
查看详情 提交询价 | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
7,408
In-stock
|
查看详情 提交询价 | ||
|
iBASE Technology | HEATSINK;HSIBR117... |
1-3 days |
8,441
In-stock
|
查看详情 提交询价 |
